Micron says it has begun the first concrete pour at its Clay, New York semiconductor site and increased planned U.S. fab and technology investments to more than $250 billion through 2035. Apple separately announced a Broadcom agreement expected to exceed $30 billion for U.S.-made chips.
Micron Technology said it has started the first concrete pour at its planned semiconductor manufacturing site in Clay, New York, marking the project’s move from site preparation to vertical construction.
In a company announcement, Micron said the milestone came more than one quarter ahead of its original plan. The company also said it is increasing planned U.S. fab and technology investments to more than $250 billion through 2035, citing demand for memory products used in data centers, artificial intelligence infrastructure and other computing markets.
Micron Chairman, President and CEO Sanjay Mehrotra said in the company’s release that “data and memory are foundational to the modern economy” and that the expanded investment is intended to support U.S.-based memory manufacturing capacity.
According to Micron, the more than $250 billion figure covers U.S. fabrication and technology investments through 2035. The company described the Clay site as part of its plan to bring advanced memory manufacturing to Central New York and strengthen the domestic semiconductor supply chain.
The project is also tied to federal and state efforts to expand semiconductor manufacturing in the United States. In Micron’s release, U.S. Commerce Secretary Howard Lutnick said the New York campus and expanded investment commitment would support “leading-edge memory supply” in the United States. Micron also thanked federal, state and local officials, including New York Governor Kathy Hochul, Senator Chuck Schumer and Onondaga County Executive Ryan McMahon.
Fox Business reported that President Donald Trump praised Micron’s $250 billion U.S. investment plan in a Truth Social post, framing the announcement as evidence that companies are accelerating domestic manufacturing. The company’s own release focuses on the construction milestone, U.S. manufacturing capacity and long-term demand for memory.
Apple also announced a separate U.S. chip-related commitment this week. In a newsroom post, Apple said it will increase spending with Broadcom under an agreement expected to exceed $30 billion. Apple said the arrangement will support production of more than 15 billion U.S.-made chips.
Apple said the chips will be produced in connection with Broadcom’s facility in Fort Collins, Colorado, and described the agreement as part of Apple’s broader $600 billion, four-year U.S. investment commitment. Apple CEO Tim Cook said in the company’s announcement that components built in Fort Collins are important to product performance and connectivity.
Reuters, as published by Investing.com, also reported that Apple plans to spend more than $30 billion under the multiyear Broadcom supply deal, noting that the agreement comes as the Trump administration pushes for more domestic chip manufacturing.
Micron’s New York milestone is notable because memory chips are a core part of computing systems used in cloud infrastructure, AI workloads, consumer devices and industrial electronics. Moving from site preparation to concrete work indicates that the Clay project has entered a more visible construction phase, though the company’s investment plan extends over the next decade.
Apple’s Broadcom agreement is separate from Micron’s fab project, but both announcements point to continued efforts by major technology companies to source more semiconductor components from U.S. facilities. The companies have not described the investments as a single joint initiative; they are distinct commitments involving different products, suppliers and manufacturing sites.
Together, the Micron and Apple announcements add to a broader reshoring push in semiconductor manufacturing. The immediate facts are narrower: Micron has begun concrete work at its New York fab site and raised its planned U.S. investment total above $250 billion through 2035, while Apple says its Broadcom agreement will exceed $30 billion and support billions of U.S.-made chips.
In a company announcement, Micron said the milestone came more than one quarter ahead of its original plan.
fab and technology investments to more than $250 billion through 2035, citing demand for memory products used in data centers, artificial intelligence infrastructure and other computing markets.
Micron Chairman, President and CEO Sanjay Mehrotra said in the company’s release that “data and memory are foundational to the modern economy” and that the expanded investment is intended to support U.S.
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